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Samsung Galaxy M47 runs Geekbench, reveals the chipset powering it‎

In March, the upcoming Samsung Galaxy M47 was spotted in the GSM Association's IMEI database, and this confirmed that the device was in development. Today, a prototype has been spotted in the Geekbench online database, and this has revealed the fact that it's powered by the Snapdragon 6 Gen 3 SoC. This was paired with 8GB of RAM in the prototype which ran the benchmark. More options could be offered as well. The phone will run Android 16 when it launches, with Samsung's One UI 8 on top. These are all the details we know about it at the moment, stay tuned for more leaks and rumors...

09:18
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GSMArena

Tecno Pova 8 Pro certifications reveal its battery capacity, RAM and storage‎

The Tecno Pova 8 was spotted in the Google Play Console last month, so we already knew it was coming. Now the Pova 8 Pro has received a certification of its own, confirming that it will be joining the vanilla model in the company's roster. The Pova 8 Pro will of course be the successor to the Pova 7 Pro, which launched last summer. The Pova 8 Pro has been certified by TUV Rheinland and the FCC. These certifications have revealed that it has a battery with a rated capacity of 6,340 mAh, which will undoubtedly be marketed as a typical capacity of 6,500 mAh. The phone's outline can...

07:17
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GSMArena

Oppo Find X9s price in India leaks again and it's higher this time‎

The Oppo Find X9s initially became official last month, and Oppo is launching it in India on May 21. Earlier this month, a rumor claimed it would start at INR 70,000 ($729). Today a new rumor says the Find X9s will actually start at INR 79,999 ($834) instead. That's a pretty wild difference, and obviously we don't know which rumor is accurate, so take all of this with a hefty pinch of salt still. The Oppo Find X9s comes with a 6.59-inch 1256x2760 AMOLED touchscreen with 120Hz refresh rate and 3,600-nit peak brightness, the Dimensity 9500s SoC at the helm, 12GB of LPDDR5X RAM, 256/512GB...

05:15
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GSMArena

Samsung's Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology‎

Samsung’s next-generation flagship chipset, the Exynos 2700, could adopt a new packaging design, according to a recent report. The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC. Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has used since the Exynos 2400, reportedly helped improve thermal performance. However, the technology is said to have been less profitable for the company due to its complex and costly manufacturing process. According to the report, which cites an industry official, Samsung plans to...

03:13
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GSMArena

Kuo: Apple is testing iPhone chipset production at Intel‎

Earlier this month, we saw a report which claimed that Apple is looking to diversify its chip production away from TSMC with Intel and Samsung as potential partners. Noted Apple analyst Ming Chi-Kuo’s latest post also backs up these claims alongside a few more details. Apple and Intel have apparently kicked off legacy Apple silicon chip production on Intel’s 18A-P process, which is equivalent to TSMC’s process used on the A18 Pro chip. According to the report, these are low-end chips set to be used in iPhone, iPads and Macs, and Kuo estimates that 80% of the chips are meant for iPhone....

01:12
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